Fanless Motion Control System with 7th/6th Gen Intel® Core™ i7/i5/i3 Desktop Processors

Fanless motion control system with IBASE MB300-TLP customized boardSupports 7th/6th Gen Intel® Core™ i7/i5/i3 processors2MB MRAM module (optional)Front removable drive bay for HDD/SSD (supports RAID 0/1)4 Axis Pulse Command Motion Control80 ch. Isolated Digital I/O (48 ch. DI / 32 ch. DO)Over/Under/Reverse voltage protectionSupports DIN-rail mount & wall mountiSMART, iAMT (11.6)

MAI602-M4D80是一台为设备自动化市场应用领域所设计的运动控制专用无风扇系统,其整合运动控制所需的各种功能,可依照客户使用需求搭载7th/6th Intel Core 35W处理器,能为客户提供出色的计算能力,其内置搭配的4轴马达控制PCIe卡,可满足控制高性能伺服/步进马达和定位精度的需求。且其马达控制PCI卡上相机触发讯号的功能能结合视觉检测的应用,提供给80点带隔离数字讯号PCIe卡,以达到控制及监控外围数字讯号开关及警报讯号的控制功能。另外,可利用主板上Mini PCI-E选择搭配广积Field Bus MotionNET 模块,来扩展I/O及马达控制,系统内提供一组USB插座,方便客户隐藏USB dongle,并能在不影响现有装置的情况下扩充增加功能,提高便利性。为因应不同产线应用的环境,本系统在设计时即以小型化、散热快速以及安装方便为设计目标,因此在机构外壳以开孔设计让系统内部能形成热流动,并在散热鳍中加入导热管,能有效的加速散热速度降低系统温度。此外,为了提升用户在硬件安装上的方便性及扩充产的兼容性,系统的I/O接口在规划之初即要求同一个面,以利使用者安装线路走线的配置规划,另为缩小产品所占空间,本产品的扩充模块走线则是以侧边开孔出线方式,并通过CE/FCC安全认证及整机系统兼容性测试,可解决客户模块兼容性问题,提高使用的安全性。

The MAI602-M4D80 is a motion control system that can be used in various factory production applications such as automated optical inspection, semiconductor wafer handling, packaging and material handling systems.

It is powered by 7th/6th Gen Intel® Core™ i7/i5/i3 desktop processors and has a 4-axis motion control PCIe card that meets the performance and positioning accuracy requirements of high-performance servo/step motors. For use in visual inspection applications, the motion control card has a camera integrated with a position comparison trigger. The system comes with a built-in 80-ch isolated digital I/O card to control and monitor the switches of surrounding digital signals and control the alarm signals. Another model, "MAI602-B", has two slots (PCIe x8 & PCIe x4 slot) to accommodate different control cards. In addition, the Mini PCI-E on board supports IBASE's Field Bus MotionNET modules for extra I/O and motion control functionalities.

The rugged MAI602-M4D80 is a fanless, compact system designed to operate at an ambient temperature of up to 50 degrees Celsius in a non-airflow environment and has protection against accidental reverse polarity, over voltage or under voltage. The compact system is designed with fast heat dissipation and easy installation, with enclosure vents that allow airflow to the internal components as well a heatpipe mechanism for fast cooling, effectively lowering system temperature. To provide ease in user installation of the hardware, the I/O interface of the system and cable routing have been all positioned on the same side.

The system measures 275mm by 140mm by 117mm and can be installed with the provided wall mount bracket or an optional DIN-rail bracket. Flexible rear I/O interface include DVI and DisplayPort display connectors, audio line-out, two serial ports, two Gigabit Ethernet ports, 2-pin power-button terminal block, and a 3-pin 24V DC-in terminal block.

System Mainboard MB300-TLP with Intel® Q170 PCH
CPU Type 7th/6th Gen Intel® Core™ i7/i5/i3 desktop processors
System Speed Up to 3.4GHz
Memory 2x DDR4-2133 SO-DIMM, Max. 32GB
Construction Aluminum & steel
Chassis Color Sliver + navy blue
Front Panel External I/O 2x Antenna hole for WLAN module
Rear Panel External I/O 1x DVI-I + 1x DisplayPort connector
1x Audio jack for Line-out
4x USB 3.0 ports, 2x USB 2.0 ports
1x Red HDD LED, 1x green power LED
2x Error LED by programming
1x Power button
1x 2-pin terminal block for external power button
1x RS232/422/485 port for COM#1
1x RS232 port for COM#2
2x RJ45 Gigabit Ethernet port
1x 3-pin DC-in terminal block type for 24V
Expansion Slots 1x Mini PCI-E sockets (full-size)
1x 4 Axis Pulse Command Motion Control
1x 80 ch. Isolated Digital I/O (48 ch. DI / 32 ch. DO)
Storage / M.2 2x 2.5” SSD + 1x mSATA socket
Mounting Desktop or wall mounting (wall mount kit included)
Side mounting
DIN-rail mounting (optional)
System Dimensions 275mm (W) x 140mm (D) x 117mm (H)
10.83” (W) x 5.51” (D) x 4.61” (H)
System Operating Temperature -10°C to 60°C (14°F~140°F)*With Air flow
-10°C to 50°C (14°F to 122°F) without Air flow
System Storage Temperature -20°C to 80°C (-4°F to 176°F)
System Relative Humidity 5~90% @ 45°C, (non-condensing)
Vibration Non-Operating: 1.0 grms / 5~500Hz / random operation
Operatiing: 0.25 grms / 5~500Hz / random operation
Certification CE / LVD / FCC Class B
MAI602-M4D80 Fanless system, w/ Intel® Core™ i5-6500TE (2.3GHz) CPU, 2x 4GB DDR4 SO-DIMM, 1x 2.5" 128GB MLC industrial-grade SSD, IP302 riser card, 4 Axis Motion card, 80 ch. Isolated Digital I/O card, w/o power adaptor
Power adaptor 180W(24V @7.5A) power adaptor, bare wire type
Compatible with IEC62368-1/EN62368-1
2021 Embedded Computing Catalog

Model Chipset Video Audio Network Others
MAI602-M4D80 Intel(R) Chipset Software Installation UtilityWindows 7 & 10 Intel(R) HD GraphicsWindows 7 (32Bit) Windows 7 (64Bit) Windows 10 Realtek High Definition AudioWindows 7 & 10 Intel(R) PRO LAN NetworkWindows 7 (32Bit) Windows 7 & 10 (64Bit) Intel(R) ME 11.xWindows 7 Windows 10 Intel(R) USB 3.0Windows 7 Motion cardWindows 7 & 10 (32Bit) Windows 7 & 10 (64Bit) Digital cardWindows 7 & 10 (32Bit) Windows 7 & 10 (64Bit)