The ET876 COM Express Type 10 CPU Module (R3.0) supports Intel's energy-efficient Atom™ Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance computing and flexible programmable graphics, making it ideal for today's mission-critical IoT, transportation, medical, military, and industrial automation applications.
The highly integrated ET876 comes in a compact form factor (84 x 55mm) and matches the performance requirements of cost-effective, small footprint embedded systems. It benefits from the Intel Gen9 graphics engine featuring DirectX 12, OpenGL 4.3 and OpenCL 2.0 to deliver stunning graphics and 4K resolution output, as well as simultaneous display combinations of DDI and LVDS or eDP. Connectivity options on the carrier board can include 8x USB 3.0, 2x USB 3.0, and 2x SATA III. All models support Gigabit connectivity, 4GB DDR3L with ECC standard, TPM hardware security and up to 32GB of eMMC storage.
The ET876 operates with an extended temperature range of -40°C to 85°C for remote outdoor deployments depending on the processor used and runs both Linux and Windows 10 operating systems.
CPU | Intel® Atom™ QC x7/ E3950 (1.6GHz~2.0GHz) Intel® Atom™ QC x5/ E3940 (1.3 GHz~1.8GHz) Intel® Atom™ DC x5/ E3930 (1.3 GHz~1.8GHz) |
PCH | Integrated in Intel® SoC |
Memory Types | Onboard memory, DDR3L 1600MHz, 4GB with ECC |
BIOS | AMI |
Watchdog Timer | 256 levels |
H/W Monitor | Yes |
Storage Device Interface | eMMC 5.0 up to 32GB (optional) |
Expansion Slots | 4x PCI-E(x1) |
Graphics Controller | Intel® SoC integrated Gen9-LP graphics |
Video Output | 1x DDI 1x LVDS or 1x eDP (optional) |
Ethernet | Intel® I210IT PCI-E Gigabit LAN |
I/O Chip | Fintek F81804U-I |
Serial Port | 2x UART (Tx/Rx only)) |
USB 2.0 | 8x USB 2.0 via Carrier Board |
USB 3.0/ 3.1 | 2x USB 3.0 via Carrier Board |
Serial ATA | 2x SATA III via Carrier Board |
Audio | Intel® Atom™ SoC built-in HD audio controller |
TPM | TPM (2.0) |
Others | I2C |
Dimensions (L X W) | 84mm x 55mm (3.3” x 2.17”) |
Power Consumption | TBD |
Operating Temperature | -40°C ~ 85°C (-40°F~185°F)(ET876-x7/x5) |
Storage Temperature | -40°C ~ 90°C (-40°F ~ 194°F) |
Relative Humidity | 90% (non-condensing @60°C) |
ET876-X7LV | COM Express (Type 10) CPU Module with Intel® Atom™ x7/ E3950 (2.0GHz) on board, LVDS, 4GB DDR3L memory on board |
ET876-X5QLV | COM Express (Type 10) CPU Module with Intel® Atom™ x5/ E3940 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board |
ET876-X5LV | COM Express (Type 10) CPU Module with Intel® Atom™ x5/ E3930 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board |
IP417 | Mini-ITX COM Express Type 10 (R3.0) Carrier Board |
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